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[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Assessment of flip chip interconnect integrity using scanning acoustic microscopy
Wolf, R.K., Hooghan, T.K., Bachman, M.A., Weachock, R.J.Year:
2000
Language:
english
DOI:
10.1109/ectc.2000.853225
File:
PDF, 1.15 MB
english, 2000