The Effect of Bonding Temperature and Curing Time on Peel...

IEEE Transactions on Device and Materials Reliability 2012 / 06 Vol. 12; Iss. 2

The Effect of Bonding Temperature and Curing Time on Peel Strength of Anisotropically Conductive Film Flex-On-Board Samples

Kiilunen, Janne, Frisk, Laura, Hoikkanen, Maija
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
12
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2012.2190413
Date:
June, 2012
File:
PDF, 593 KB
english, 2012
Conversion to is in progress
Conversion to is failed