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[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Thermal and electrical performance for wafer level package
Sang Wook Park,, Jae Myun Kim,, Hyung Gil Baik,, Sang Ha Kim,, Joon Ki Hong,, Heung Sup Chun,Year:
2000
Language:
english
DOI:
10.1109/ectc.2000.853167
File:
PDF, 740 KB
english, 2000