Energy Release Rate Estimation for Through Silicon Vias in...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 01 Vol. 4; Iss. 1

Energy Release Rate Estimation for Through Silicon Vias in 3-D IC Integration

Ming-Che Hsieh,, Sheng-Tsai Wu,, Chung-Jung Wu,, Lau, John H.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2283503
Date:
January, 2014
File:
PDF, 3.42 MB
english, 2014
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