[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Method for back-annotating per-transistor power values onto 3DIC layouts to enable detailed thermal analysis
Melamed, Samson, Imura, Fumito, Aoyagi, Masahiro, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, YukohYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826697
File:
PDF, 1.50 MB
english, 2014