[IEEE 2010 IEEE 3rd International Nanoelectronics Conference (INEC) - Hong Kong, China (2010.01.3-2010.01.8)] 2010 3rd International Nanoelectronics Conference (INEC) - Copper seed layer using atomic layer deposition for Cu interconnect
Moon, Dae-Yong, Kwon, Tae-Suk, Kang, Byung-Woo, Kim, Woong-Sun, Kim, Baek Mann, Kim, Jae Hong, Park, Jong-WanYear:
2010
Language:
english
DOI:
10.1109/inec.2010.5424775
File:
PDF, 259 KB
english, 2010