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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Systematic Pd Cu wire bond recipe development flow for successful qualification result
Law Lai Cheng,, Wong Boh Kid,, Hiew Pey Fang,, Eu Poh Leng,Year:
2012
Language:
english
DOI:
10.1109/emap.2012.6507907
File:
PDF, 434 KB
english, 2012