[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - A new 2.5D TSV package assembly approach
Lu, Yuan, Yin, Wen, Zhang, Bo, Yu, Daquan, Wan, Lixi, Shangguan, Dongkai, Xia, Guofeng, Qin, Fei, Ru, Mao, Xiao, FeiYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575847
File:
PDF, 1.65 MB
english, 2013