IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1994 / Aug. Vol. 17; Iss. 3
3D-WASP devices for on-line signal and data processing
Hedge, S.J., Habiger, C.M., Lea, R.M.Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.311781
Date:
January, 1994
File:
PDF, 1004 KB
english, 1994