A 3-chamber deposition system for the simultaneous...

IEEE Transactions on Appiled Superconductivity 2001 / 3 Vol. 11; Iss. 1

A 3-chamber deposition system for the simultaneous double-sided coating of 5-inch wafers

Geerk, J., Zaitsev, A., Linker, G., Aidam, R., Schneider, R., Ratzel, F., Fromknecht, R., Scheerer, B., Reiner, H., Gagnidze, E., Schwab, R.
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Volume:
11
Language:
english
Journal:
IEEE Transactions on Appiled Superconductivity
DOI:
10.1109/77.919906
Date:
March, 2001
File:
PDF, 319 KB
english, 2001
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