Feasibility Study of Process Integration for High Aspect Ratio Hard-Mask Scheme Technologies of Low-k/Cu Interconnect Fabrication
Weng, Chun-JenVolume:
26
Language:
english
Journal:
Materials and Manufacturing Processes
DOI:
10.1080/10426914.2010.529592
Date:
September, 2011
File:
PDF, 1.57 MB
english, 2011