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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Formation of single phase Cu-Sn IMCs via layer-by-layer electroplating of Cu and Sn metals
An, Rong, Ma, Huiwen, Li, Hailong, Zheng, Zhen, Wang, ChunqingYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922811
File:
PDF, 1.46 MB
english, 2014