![](/img/cover-not-exists.png)
[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Delamination toughness of Cu-EMC interfaces at harsh environment
Sadeghinia, M., Jansen, K. M. B., Ernst, L. J., Schlottig, G., Pape, H.Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898787
File:
PDF, 696 KB
english, 2011