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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Experimental characterization of adhesion between micro-size polymer particles and silicon substrates
Ding, Weiqiang, Zhang, Huan, Cetinkaya, CetinYear:
2008
Language:
english
DOI:
10.1109/itherm.2008.4544365
File:
PDF, 216 KB
english, 2008