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[IEEE IEEE Symposium Conference Record Nuclear Science 2004. - Rome, Italy (16-22 Oct. 2004)] IEEE Symposium Conference Record Nuclear Science 2004. - Test chip for bump bond yield evaluation in high density flip chip technologies
Ullan, M., Lozano, M., Chmeissani, M., Blanchot, G., Cabruja, E., Garcia, J., Maiorino, M., Martinez, R., Pellegrini, G., Puigdengoles, C.Volume:
7
Year:
2004
Language:
english
DOI:
10.1109/nssmic.2004.1466849
File:
PDF, 1.11 MB
english, 2004