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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Integration Aspects of CoWP Capping Layers for Electromigration Enhancement

Preusse, A., Seidel, R., Aubel, O., Nopper, M., Freudenberg, B., Schaller, M., Fecher, M., Letz, T., Bartsch, C., Ott, A., Friedemann, M., Feustel, F., Meyer, M.A., Limbecker, P.
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Year:
2008
Language:
english
DOI:
10.1109/iitc.2008.4546943
File:
PDF, 530 KB
english, 2008
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