IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1996 / Nov. Vol. 19; Iss. 4
Extraction of the capacitance matrix of multiconductor interconnection lines for high-speed IC system design
Shui-Ping Luo,, Zheng-Fan Li,Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.544369
Date:
January, 1996
File:
PDF, 524 KB
english, 1996