[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Investigations of void forming and shear strength of Sn42Bi58 solder joints for low cost applications
Herzog, Th., Wolter, K.-J., Poetzsch, F.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216537
File:
PDF, 659 KB
english, 2003