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[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Effect of in addition on the reaction and mechanical properties in Sn-Ag-Cu-In solder alloy
A Mi Yu,, Chang-Woo Lee,, Jeong-Han Kim,, Mok-Soon Kim,, Jong-Hyun Lee,Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510328
File:
PDF, 4.49 MB
english, 2007