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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Strain field simulation of transferring process on large wafers
Liang, Tang, Lezhi, YeYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922788
File:
PDF, 288 KB
english, 2014