[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Dispensed dome lens validation through optical simulations for high irradiance UV LED module
Cheng-Chun Liao,, Hao-Xiang Lin,, Chang Chien, Chien-Lin, Chang, Chung-Min, Chih-Peng Hsu,Year:
2014
Language:
english
DOI:
10.1109/icep.2014.6826764
File:
PDF, 1.19 MB
english, 2014