[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Effect of Vacuum Package on the Stiction Force of Micro-structure
Liu, Junwen, Song, Jing, Huang, Qingan, Tang, JieyingYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441527
File:
PDF, 1.50 MB
english, 2007