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[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Copper wire bond on MCM device (bond stitch on bump ball)
Tan Boo Wei,, Niu You Hua,Year:
2012
Language:
english
DOI:
10.1109/iemt.2012.6521750
File:
PDF, 836 KB
english, 2012