Three-dimensional memory module

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1998 / Feb. Vol. 21; Iss. 1

Three-dimensional memory module

Takahashi, N., Senba, N., Shimada, Y., Morisaki, I., Tokuno, K.
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Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.659501
Date:
January, 1998
File:
PDF, 172 KB
english, 1998
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