[IEEE TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Beijing, China (2011.06.5-2011.06.9)] 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Crack propagation direction control for crack-less solder bonding using Al/Ni flash heating technique
Namazu, T., Ohtani, K., Yoshiki, K., Inoue, S.Year:
2011
Language:
english
DOI:
10.1109/transducers.2011.5969524
File:
PDF, 1.18 MB
english, 2011