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[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Package-to-board transition via parasitic effects on simultaneous switching noise
Xin Wu,, Schicht, S.Year:
2006
Language:
english
DOI:
10.1109/isemc.2006.1706411
File:
PDF, 418 KB
english, 2006