[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - A new concept for using of Al-sheet as integrated substrate for one or multichip module package
Philippov, Ph., Arnaudov, R., Yordanov, N., Gospodinova, M.Year:
1998
Language:
english
DOI:
10.1109/icmcm.1998.670764
File:
PDF, 496 KB
english, 1998