[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - From wafer level to panel level mold embedding
Braun, T., Becker, K.-F., Voges, S., Thomas, T., Kahle, R., Bauer, J., Aschenbrenner, R., Lang, K.-D.Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575733
File:
PDF, 678 KB
english, 2013