[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Implementation of a mobile phone module with redistributed chip packaging
Ramanathan, Lakshmi N., Keser, Beth, Amrine, Craig, Duong, Trung, Hayes, Scott, Leal, George, Mangrum, Marc, Mitchell, Douglas, Wenzel, RobertYear:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550115
File:
PDF, 801 KB
english, 2008