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[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - The effect of underfill imperfections on the reliability of flip chip modules: FEM simulations and experiments
Rzepka, S., Feustel, F., Meusel, E., Korhonen, M.A., Che-Yu Li,Year:
1998
Language:
english
DOI:
10.1109/ectc.1998.678719
File:
PDF, 1.63 MB
english, 1998