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Processing of fluxing underfills for flip chip-on-laminate assembly
Zhao, R., Johnson, R.W., Jones, G., Yaeger, E., Konarski, M., Krug, P., Crane, L.L.Volume:
26
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2003.813007
Date:
January, 2003
File:
PDF, 1.12 MB
english, 2003