[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Thermal Numerical Simulation and Correlation for a Power Package
Yuan, Zhongfa, Liu, Yong, Irving, Scott, Luk, Timwah, Zhang, JiangyuanYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441399
File:
PDF, 1.61 MB
english, 2007