[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Investigation of stress-buffer-enhanced package subjected to board-level drop test
Chan-Yen Chou,, Tuan-Yu Hung,, Ming-Chih Yew,, Wen-Kun Yang,, Dyi-Chung Hu,, Mon-Chin Tsai,, Ching-Shun Huang,, Kuo-Ning Chiang,Year:
2008
Language:
english
DOI:
10.1109/esime.2008.4525014
File:
PDF, 1.12 MB
english, 2008