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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling
Zhang, H.Y., Pinjala, D., Poi-Siong Teo,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271593
File:
PDF, 443 KB
english, 2003