[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - High speed ball pull -- A predictor of brittle solder joints
Pandher, R., Boureghda, M., Athavale, S.Year:
2006
Language:
english
DOI:
10.1109/eptc.2006.342799
File:
PDF, 510 KB
english, 2006