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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Mechanical Reliability Evaluation of Sn-37Pb/Cu and Sn-37Pb/ENIG Solder Joints by using High Speed Lap-shear Test
Jeon, Seong-jae, Hyun, Seungmin, Lee, Hak-Joo, Kim, Jong-woong, Jung, Seung-Boo, Lee, Hoo-JeongYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763485
File:
PDF, 3.21 MB
english, 2008