![](/img/cover-not-exists.png)
[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages
Dowhan, Lukasz, Wymyslowski, Artur, Dudek, RainerYear:
2007
Language:
english
DOI:
10.1109/esime.2007.359963
File:
PDF, 1014 KB
english, 2007