[IEEE 2010 Proceedings 60th Electronic Components and...

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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Quantification of micropartial residual stress for mechanical characterization of TSV through nanoinstrumented indentation testing

Lee, Gyujei, Son, Ho Young, Hong, Joon Ki, Byun, Kwang Yoo, Kwon, Dongil
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Year:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490902
File:
PDF, 934 KB
english, 2010
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