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[IEEE 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Marina Bay Sands, Singapore (2014.6.30-2014.7.4)] Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Decapsulation of silver-alloy wire-bonded devices
Kerisit, Francois, Lefevre, Matthew J., Domenges, Bernadette, Prellier, Wilfrid, Obein, MichaelYear:
2014
DOI:
10.1109/ipfa.2014.6898187
File:
PDF, 1.10 MB
2014