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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Moisture absorption mechanism in epoxy molding compounds used in IC encapsulation
Premkumar, Jeromerajan, Srikanth, NarasimaluYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342691
File:
PDF, 238 KB
english, 2006