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[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Characterization of wafer level package for mobile phone application
Ji-Yon Kim,, Kang, I.S., Park, M.G., Kim, J.H., Cho, S.J., Park, L.S., Chun, H.S.Year:
2001
Language:
english
DOI:
10.1109/ectc.2001.928016
File:
PDF, 346 KB
english, 2001