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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - A Flip Chip Package for Thermal Mass Flowmeter
Cao, Hui, Gan, Zhiyin, Luo, Xiaobing, Yu, Boling, Liu, ShengYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359870
File:
PDF, 3.36 MB
english, 2006