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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Laser Assisted Solder Bump Mold Fabrication
Lim, Yong-Jin, Jung, Seoung-Ho, Park, Sang-il, Choi, Jung-Su, Choi, Eun-Youl, Kim, Chung-TaeYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763431
File:
PDF, 4.35 MB
english, 2008