![](/img/cover-not-exists.png)
[IEEE 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Hose, CA, USA (2014.5.20-2014.5.23)] IEEE International Interconnect Technology Conference - Wire bond pull test and its correct uses
Li, Lan, Li, KevinYear:
2014
Language:
english
DOI:
10.1109/iitc.2014.6831847
File:
PDF, 654 KB
english, 2014