Development of a Novel Microimpact-Fatigue Tester and Its...

IEEE Transactions on Components and Packaging Technologies 2009 / 09 Vol. 32; Iss. 3

Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints

Kim, Ilho, Lee, Soon-Bok
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2027426
Date:
September, 2009
File:
PDF, 20.88 MB
english, 2009
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