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Thermal expansion behavior and performance of VLP diffusion-bonded joints of SiCp/A356 composites
Zhiwu Xu, Jiuchun Yan, Weiwei Zhao, Huibin Xu, Shiqin YangVolume:
65
Year:
2005
Language:
english
Pages:
7
DOI:
10.1016/j.compscitech.2004.11.013
File:
PDF, 605 KB
english, 2005