Investigation of crack propagation in ceramic/conductive...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / Sept. Vol. 18; Iss. 3

Investigation of crack propagation in ceramic/conductive epoxy/glass systems

Sheng Liu,, Zhu, J.S., Hu, J.M., Yi-Hsin Pao,
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.465162
Date:
January, 1995
File:
PDF, 602 KB
english, 1995
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