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[IEEE 2010 International Conference on Enabling Science and Nanotechnology (ESciNano) - Kuala Lumpur, Malaysia (2010.12.1-2010.12.3)] 2010 International Conference on Enabling Science and Nanotechnology (ESciNano) - Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate
Kuo, Chien-I, Wee Chin Lim,, Heng-Tung Hsu,, Chin-Te Wang,, Li-Han Hsu,, Aizad, Faiz, Guo-Wei Hung,, Miyamoto, Yasuyuki, Chang, Edward YiYear:
2010
Language:
english
DOI:
10.1109/escinano.2010.5700949
File:
PDF, 469 KB
english, 2010