[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - An innovative surrogate chip for accurate high-speed wire bond package measurement
Shi, Hong, Low, Hoon Ngik, Xiaohong Jiang,, Ying Fei Tan,, Wai Ling Lee,, Tan, Siow Chek, Chong, Swee Fong, John Xie,, Ping Chet Tan,, Loon Kwang Tan,, Lim, Chong Poh, Chiun Ning Liew,Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702670
File:
PDF, 1.46 MB
english, 2010