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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Compliant Wafer Level Package for Enhanced Reliability
Gao, Guilian, Haba, Bel, Oganesian, Vage, Honer, Ken, Ovrutsky, David, Rosenstein, Charles, Axelrod, Ekaterina, Hazanovich, Felix, Aksenton, YuliaYear:
2007
Language:
english
DOI:
10.1109/hdp.2007.4283563
File:
PDF, 1.51 MB
english, 2007